John Schreck is the former senior vice president (retired) of DRAM Engineering at Micron Technology and in December 2022 became the CEO of the Texas Institute for Electronics (TIE). In his role as SVP of DRAM Engineering, Mr. Schreck was responsible for Micron’s international team of design and product engineering with responsibilities including new technology development and high bandwidth memory (HBM) engineering. He holds a bachelor’s in electrical and electronics engineering from UT Austin and a master’s in electrical and electronics engineering from Rice University.