Dr. Eric Forsythe is the Technical Director for the CHIPS Manufacturing USA Program, leading the execution of the Digital Twin for Manufacturing institute. This institute is bringing together the semiconductor, advanced packaging, assembly, and test manufacturing sectors to accelerate digital twin technology in support of the CHIPS Program goals.
Prior to joining NIST, Dr. Forsythe was a Program Manager at the U.S. Army Combat Capabilities Development Command, Army Research Laboratory, where he developed and managed public-private partnerships to deliver DoD manufacturing solutions for flexible hybrid electronics, flexible x-ray imagers, and displays. Dr. Forsythe managed several research groups at ARL that developed organic light-emitting diode materials and devices, flexible sensors, and most recently, 3-dimensional hybrid electronics circuits for extreme environments.
Dr. Forsythe was a Post-Doctoral Fellow at the University of Rochester in the Physics and Chemistry Departments, where he studied organic light-emitting displays. He holds a Ph.D. in Physics from Stevens Institute of Technology.