Makai’s TFHX represents an important advance in compact heat exchanger technology. Its innovative design enables higher heat transfer surface area densities, maximizing heat transfer performance in a compact envelope. The thin layers of each TFHX plate mean more heat transfer area can be packed into a fixed volume.
Primary Application Area: Energy, Infrastructure, Resilience
Technology Development Status: Ready to Market
Technology Readiness Level: TRL 6
Vetted Programs/Awards: ONR Grant >$20 MM since 2009; USAF Phase I&II SBIRs; US Army Phase I&II SBIRs
Organization Type: Corporation
GOVT/EXTERNAL FUNDING SOURCES