Fortify has commercialized a 3D Printing platform that enables new material properties by processing complex, heavily loaded resins. Areas of focus include: Low loss dielectrics for RF devices, advanced ceramics, and advanced thermal applications. Fortify 3D Printers are open access and ideal for material development
Primary Application Area: Materials & Manufacturing
Technology Development Status: Ready to Market
Technology Readiness Level: TRL 8
Vetted Programs/Awards: Fortify was awarded a NSF SBIR Phase II Grant to establish a thermally conductive and mechanically robust photoresin to manufacture bespoke injection mold tooling capable of faster cycle time and more parts. Fortify has increased thermal conductivity by 3.5X and mechanics by 50% over competitive resins.
Organization Type: Mid-stage Startup (A or B)
GOVT/EXTERNAL FUNDING SOURCES
External Funding to Date: Fortify has completed a seed round of $2.5M, a series A of $10M investment and a recent (Q1 2021) series B round of $20M.
Fortify was also awarded the $50,000 MassChallenge Gold Award in 2016.