Indium-based solders are used for soldering components in electronic packaging. We have developed a printable indium ink that is capable of printing features down to a few microns for high-definition electronics. The ink contains indium particles that are much smaller than typical screen-printed solders used today for electronics packaging.
Primary Application Area: Materials & Manufacturing
Technology Development Status: Prototype
Technology Readiness Level: TRL 4
Organization Type: Small to Medium Enterprise
GOVT/EXTERNAL FUNDING SOURCES