Matthew Walsh is the Advanced Packaging Chief Engineer for the Florida Semiconductor Engine. He is a Subject Matter Expert for microelectronics packaging, specifically advanced 3-D heterogeneous packaging. Mr. Walsh has been in the electronics industry since 1988 with most of those years in industry developing IC packaging technologies, powertrain electronics, radar sensors and harsh environment electronics for automotive and commercial vehicles. He also spent 15 years with the Department of Defense Navy. Within the Navy, Mr. Walsh was Advanced Radars Chief Engineer developing advanced packaging technologies for next generation radars, electronic warfare, and communication sensors. He was also detailed to the Secretary of Defense, Industrial Base Acquisition and Sustainment program which aims to improve the readiness and competitiveness of the US industrial base by establishing high priority domestic capabilities for supply chains needed for national security. Mr. Walsh led the effort to onshore Advanced Packaging capabilities to the US for DoD and Commercial applications. Mr. Walsh has 13 published papers, 8 patents and 4 defensive publications in the automotive world, and 5 patents with the Navy.