Join the AI TechConnect Virtual Summit Series as we connect emerging best practices in AI and Machine Learning with industry and research initiatives.  Register today and learn about the deployment and adoption of AI and machine learning processes into key industry sectors.  Sign up for all five (5) events in the series, or select the the summit aligned with your interests:

On Demand AI for Advanced Manufacturing View Program
On Demand AI for Materials Characterization View Program
On Demand AI for Medical & Biomaterials View Program
On Demand AI for Materials Discovery View Program
On Demand AI for Materials Design & Innovation View Program

Key Speakers & Chairs Include:

Yuling AnYuling An

Schrodinger, Inc.

André-Pierre Blanchard-DionneAndré-Pierre Blanchard-Dionne

EPFL (École Polytechnique Fédérale de Lausanne

Prasanna V. BalachandranPrasanna V. Balachandran

University of Virginia

Mathieu BauchyMathieu Bauchy


Keith BrownKeith Brown

Boston University

Tonio BuonassisiTonio Buonassisi


Glenn ButterfossGlenn Butterfoss


Fiona CaseFiona Case


Connor ColeyConnor Coley

Massachusetts Institute of Technology

Payel DasPayel Das

IBM Thomas J Watson Research Center

Ishita ChakrabortyIshita Chakraborty

Stress Engineering Services

Greg HaugstadGreg Haugstad

University of Minnesota

Jayant R. KalagnanamJayant R. Kalagnanam

IBM Research

Philip M. KimPhilip M. Kim

University of Toronto

Peter KoenigPeter Koenig

Procter & Gamble

Christoph KreisbeckChristoph Kreisbeck


Aaron Gilad KusneAaron Gilad Kusne

National Institute of Standards and Technology

Chris MilroyChris Milroy


Yifei MoYifei Mo

University of Maryland

Changning NiuChangning Niu

QuesTek Innovations

Matthew PowelsonMatthew Powelson

Southwest Research Institute

Patrick RileyPatrick Riley


Rick RossRick Ross

3M Company

Subramanian SankaranarayananSubramanian Sankaranarayanan

Argonne National Laboratory

Mary ScottMary Scott

University of California, Berkeley

Brent M. SegalBrent M. Segal

Lockheed Martin

Yang ShenYang Shen

Texas A&M University

Lalitha SubramanianLalitha Subramanian

Dassault Systèmes

Sarah TaoSarah Tao


Jianzhong WuJianzhong Wu

University of California, Riverside

Huolin XinHuolin Xin

University of California, Irvine

Dalia YablonDalia Yablon


Maxim A. ZiatdinovMaxim A. Ziatdinov

Oak Ridge National Laboratory

"TechConnect World is an excellent opportunity to meet all key innovation players and stakeholders all in one place — at the premier innovation commercialization and networking event in the US."


" TechConnect is unique in specifically bringing together the creators of breakthrough technologies with corporations who can help commercialize, adopt, buy, re-sell and invest in those technologies"

Atrium Capital

"We come back to TechConnect World because they provide us the opportunity to meet top innovators across many technology areas all in one location."

Lockheed Martin