Application of Chemical Mechanical Polishing for Synergistic Surface Nano-structuring and Interface Control

G. Bahar Basim
University of Florida, Florida, United States

Keywords: Chemical Mechanical Polishing, Titanium based medical implants, Surface/interface nano structuring, surface energy control

The native oxide layer of titanium spontaneously forms in air is typically amorphous and stoichiometrically defective [1-2]. Implementation of chemical mechanical polishing (CMP) process grows a protective oxide film on the implant surface and helps in limiting the bacteria growth by forming a protective thin surface oxide layer. It is demonstrated that although the increase in the surface roughness promotes the hydroxyapatite attachment linearly, the cell attachment is indirectly correlated to roughness. There is an optimal level of roughness on which the cell attachment is maximized. Overall, the CMP process changes the surface structure and composition as a function of the slurry particle size as well as the slurry chemical composition favoring the biocompatibility of the implants [3]. The nano-scale surface structuring method through Chemical Mechanical Polishing can be implemented to other metallic substrates to modify the surface energy and interface compatibility to prevent corrosion, scale formation, effectiveness of coatings as well as many other industrial applications. [1] E. Kleiner and N.H.A. Camargo, Matéria (Rio J.) 12, 525 (2007). [2] F. Variola et al, Biomaterials 29, 1285 (2008). [3] Z. Ozdemir et al, Mater. Sci. Eng., C. 68, 383 (2016).