High Density Through Glass Via (TGV) Interposers for 3D Packaging and Ultra-High Resolution Cameras.

T. Collier
CVInc, United States

Keywords: interposers, substrates, TGV, PCB, electronic assembly

Higher density cannot be achieved using traditional printed circuit boards. Those boards dont support 2.5 and 3D packaging and have drawbacks with high frequency. By using glass, instead of silicon, higher density interconnect can be formed without the electro-mechanical issues associated with silicon through vias. The presenter has realized 20:1 aspect ratio via in 500um thick glass materials with vias as small as 25um Diameter. By adding metal routing on top and bottom surfaces, a true 3D interface is realized with pitch as small as 50um.