A Novel Approach for Complex Electronic Interconnects: High Density, Flexible Substrates, Pressure and Temperature Sensitive

M. Ramkumar and M. Stemmermann
SunRay Scientific, United States

Keywords: Z-Axis, Magnetically Aligned, Electrical Interconnect, High Density Interconnects, Pressureless ACA

Military and industrial applications call for electrical devices that are smaller, faster, more flexible, and more rugged. Conventional solder connections are rigid and brittle. Furthermore, the existing processes for making electrical circuit interconnections by soldering prevents high-density interconnections and strong adhesion of components, especially on flexible substrates. SunRay Scientific has developed a novel method of interconnecting circuitry, known as ZTACH® ACA, that is faster and simpler than solder, ACF or wire bonding and allows for circuits to bend/ fold while maintaining electrical connectivity. Unlike solder, ZTACH requires no pressure and low-temperature curing when bonding circuits to substrates. ZTACH has the resolution to interconnect circuit elements on the nanometer scale. ZTACH also has radiation-hardness & high Radio Frequency (90 GHz) resiliency. The underlying technology of ZTACH is a suspension of ferromagnetic nanoparticles within an epoxy blend matrix. In the presence of a easily integrated magnetic field, the particles self-assemble into conductive columns that connect the electrical contact points between opposing circuit faces (Z-Axis). Commercialized ZTACH® ACA material will revolutionize the electronics industry by sustaining the miniaturization trends of HDI electronics and enabling the design and production of flexible 3D circuitry that is beyond the capabilities of existing manufacturing methods.