AI Spring Conference & Expo

June 17-19, 2019 | Boston, MA | Co-Located with:

Co-Located with TechConnect World Innovation Conference & Expo SBIR/STTR Spring Innovation Conference Nanotech 2019

AI & MACHINE LEARNING

ACCELERATING INDUSTRY SOLUTIONS.

Connecting emerging tools and platforms with the global innovation ecosystem. Join us for the inaugural AI TechConnect program in Boston. Submit your abstract and join the program.

 
 

AI TechConnect Program

2019 Program: At-A-Glance

Monday June 17

10:30AWS AI & Cyber Innovation Programs
10:30AI for Advanced Manufacturing
1:30Amazon Web Services - AWS Innovation Programs & Workshop
1:30AI for Biomaterials, Medical and Biotech Applications
3:00Data/AI/Cyber Innovation Spotlights: DOD/USINDOPACOM & MIT Innovation Initiative

Tuesday June 18

10:30AI for Materials Development
1:30AI for Materials Development

Wednesday June 19

8:30AI Keynotes
10:30AI for Materials Development
1:30AI Innovations & Implementation
3:30TechConnect Innovation Leaders Networking Reception - Poster Session II
3:30Materials Modeling, Informatics & Machine Learning: Posters
3:30AI & Machine Learning Applications: Posters

Detailed Program:

Monday June 17

10:30AWS AI & Cyber Innovation Programs308
10:30Artificial Intelligence and Machine Learning on AWS
Amazon Web Services, US
11:15Cybersecurity Innovation in the Cloud
Amazon Web Services, US
10:30AI for Advanced Manufacturing304
Session chair: Brent Segal, Lockheed Martin, US
10:30AI at Scale: Real World Industrial Applications
C. Lefebvre, nDimensional, US
10:50Science-Guided AI for Development of New Biofuels and Bioenergy Production Technologies
M. Urgun-Demirtas, Y. Lin, P. Laible, Argonne National Laboratory, US
11:10Rapid Artificially Intelligent Design
S. Guerin, Z. Rogers, Additive Rocket Corporation, US
11:30Robot Axis Control Using a Differential Learning Algorithm
B. Abegaz, Loyola University of Chicago, US
11:50Tension prediction using web moving speed and natural vibration frequency
X. Du, J. Yan, University of Massachusetts, Amherst, US
1:30Amazon Web Services - AWS Innovation Programs & Workshop308
1:30Startup Resources for Accelerated Growth
Amazon Web Services, US
2:15AWS GovCloud, Compliance and Security
Amazon Web Services, US
3:15Startup Success Stories in Highly Regulated Markets
Amazon Web Services, US
4:00Aerospace and the Cloud
Amazon Web Services, US
1:30AI for Biomaterials, Medical and Biotech Applications304
Session chair: Sarah Tao, Sanofi, US
1:30Automating Chemical Synthesis using AI and Automated Systems
P. Madrid, J.P. Malerich, M. Latendresse, M. Krummenacker, D. Stout, J-P. Lim, Vi-Anh Vu, J. Szeto, K. Rucker, J. White, N. Collins, SRI, US
1:55The Concept of “Sniper Shoot” in Discovery of a New Drugs
A. Yu Rogachev, Illinois Institute of Technology, US
2:15Next-Generation Cheminformatics Approaches for Rational Drug Discovery
D. Fourches, North Carolina State University, US
2:35Deep convolutional neural network and image prior based super resolution for X-ray nano-tomography
K.C. Prabhat, V. DeAndrade, N. Kasturi, X. Yang, Argonne National Laboratory; The University of Chicago, US
2:55Effective Radiation Therapy Using Accurate Tumor Segmentation
G. Rasool, Rowan University, US
3:00Data/AI/Cyber Innovation Spotlights: DOD/USINDOPACOM & MIT Innovation Initiative303
Session chair: Jennifer Rocha, TechConnect, US
3:00MIT Innovation Initiative Spotlight
G. Keselman, MIT Innovation Initiative, US
3:15USINDOPACOM Innovation Spotlight
R. Roley, USINDOPACOM, US
3:30Social Media Environment and Internet Replication (SMEIR)
A. Furuta, IDS International Government Services, US
3:37rasdaman
P. Baumann, rasdaman GmbH, DE
3:44Artificial intelligence, machine learning, machine vision for infrastructure and road surface assessments
B. Utter, RoadBotics, US
3:51Skylight - A Big Data Platform for Buildings
J. Hahn, Site 1001, US
3:58HADES - High-Fidelity Adaptive Deception & Emulation System
V. Urias, Sandia National Laboratories, US
4:05Geoanalytics Platform for Special Operations Mission Readiness
S. Moola, EPIC Ready, US
4:12Curve3d
M. Script, vClick3d, US
Review Panelist
N. Rao, US Small Business Administration, US
Review Panelist
G. Keselman, MIT Innovation Initiative, US
Review Panelist
R. Roley, USINDOPACOM, US
Review Panelist
B. Segal, Lockheed Martin, US
Review Panelist
S. Stella, Electric Power Research Institute (EPRI), US

Tuesday June 18

10:30AI for Materials Development304
Session chair: Peter Koenig, Procter & Gamble, US
10:30Learning from Small Data: Optimization of Complex Material Systems with Hierarchical Machine Learning
A. Menon, N. Washburn, Carnegie Mellon University, US
10:55AI and Machine Learning for Accelerating Materials Design and Discovery
S. Sankaranarayanan, Argonne National Laboratory, US
11:20Graph Networks as a Universal Machine Learning Framework for Molecules and Crystals
C. Chen, University of California, San Diego, US
11:45Combining data-driven models with physics-based models for industrial materials discovery, design, and manufacturing
L. Subramanian, Dassault Systems, US
12:10Accelerating Materials Development with Uncertainty-Aware Sequential Learning
M. Hutchinson, Citrine Informatics, CA
1:30AI for Materials Development304
Session chair: Keith Brown, Boston University, US
1:30Towards Autonomous Materials Research Systems
J. Hattrick-Simpers, NIST, US
1:55Autonomous Research for Carbon Nanotube Synthesis
Benji Maruyama, Air Force Research Laboratory, US
2:20Polymer Genome: An Informatics Platform for Rational Polymer Design
H. Tran, Georgia Institute of Technology, US
2:45A Self-Driving Laboratory for Accelerating Materials Discovery
C.P. Berlinguette, J.E. Hein, A. Aspuru-Guzik, B.P. MacLeod, F.G.L. Parlane, B. Lam, University of British Columbia, CA
3:05Smart design of organic and organometallic materials using automated machine learning methods and workflows
H.S. Kwak, T. Robertson, C.M. Krauter, K. Leswing, M.D. Halls, Schrodinger, Inc., US
3:25Computational screening of Li and Na fast ion conductors using high-throughput bond-valence calculations and machine-learning analysis
Javier Carrasco, CIC Energigune, ES

Wednesday June 19

8:30AI Keynotes304
Session chair: Brent Segal, Lockheed Martin, US
8:30Welcome - Sector Expanding AI Innovation Impact
B.M. Segal, Lockheed Martin, US
8:55AI and Robotics for Rapid Innovation of Materials
J.S. Becker, Kebotix, US
9:20Advances in AI for Design and Discovery
J. Kautz, NVIDIA, US
10:30AI for Materials Development304
Session chair: Peter Koenig, Procter & Gamble, US
10:30The Search for Ground Truth: Machine Learning for Mechanical Design
K. Brown, Boston University, US
10:55Towards Trusted AI For Advancing Science and Innovation
P. Das, IBM Thomas J Watson Research Center, US
11:20Predicting potential energy surfaces with machine learning
M. Hellström, Software for Chemistry & Materials BV, NL
11:40Coarse-grained modeling of polycrystalline ice in supercooled water
H. Chan, M. Cherukara, B. Narayanan, T. Loeffler, C. Benmore, S. Gray, S. Sankaranarayanan, Argonne National Laboratory, US
12:00Machine Learning for Glass Science and Engineering
M. Bauchy, University of California, Los Angeles, US
1:30AI Innovations & Implementation304
Session chair: Brent Segal, Lockheed Martin, US
1:303 Tiers of Cyber Security - The Future of Cyber Science
M.H. Nance, C. Johnson-Bey, Lockheed Martin, US
1:50MiniZinc - a constraint modeling language
D. Hemmi, Monash University, AU
2:10Telling the story of AI internally - the missing piece of implementation
E. Thoresen, Midwest Capital Group, US
3:30TechConnect Innovation Leaders Networking Reception - Poster Session IIBoylston Hallway
3:30Materials Modeling, Informatics & Machine Learning: PostersBoylston Hallway
Analysis of Gate-Length Dependence of Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs
T. Chiba, Y. Saito, R. Tsurumaki, K. Horio, Shibaura Institute of Technology, JP
Analysis of Breakdown Characteristics in Field-Plate AlGaN/GaN HEMTs: Dependence on Deep-Acceptor Density in Buffer Layer
S. Akiyama, M. Kondo, L. Wada, K. Horio, Shibaura Institute of Technology, JP
Improved Electric Field Decomposition Capacitance Model with 3-D Terminal and Fringe Components in Sub-28nm Interconnect
S. Ueda, R. Tomita, Y. Kawada, K. Horio, Shibaura Institute of Technology, JP
Interaction modeling of interfacial surfaces with molecular agents: an approach to the problem of bioaccumulation of lead in fish
O. Torres, E. González, Pontificia Universidad Javeriana, CO
Molecular Dynamics Simulation Study on Nanoelectromechanical Oscillator based on Graphene Nanoflake
O.K. Kwon, J.W. Kang, Semyung University, KR
Violation of the Zeroth Law of Thermodynamics -- Thermodynamic Properties of a long-range Interacting System
Z-Y. Yang, Duke University, US
3:30AI & Machine Learning Applications: PostersBoylston Hallway
Intelligent Transportation Asset Management System
P. Bhavsar, N. Bouaynaya, Y. Mehta, G. Rasool, CREATEs at Rowan University, US
A Learning-based Approach to Cover Short-term Camera Failure in a Monocular Visual Inertial Odometry System
Y. Tian, Embry-Riddle Aeronautical University, US
Feedback Control of an ROS-Enabled Autonomous Vehicle
B. Abegaz, Loyola University of Chicago, US
Smart Control of an Electric Power Assisted Steering (EPAS)
B. Abegaz, Loyola University of Chicago, US
Fader Axis
D. Hemmi, Monash University, AU
Bayesian Reasoning For Better Thinking
D. Hemmi, Monash University, AU
Image-based damage conditional assessment of large-scale infrastructure systems using remote sensing and deep learning approaches
H. Pan, Z. Zhang, X. Wang, Z. Lin, North Dakota State University, US
Real World Optimization of Traffic Flow Inside a Large Manufacturing Facility
M. Griffin, Insight, US
 

Produced by

TechConnect
 

© Copyright 2019 TechConnect. All Rights Reserved. Disclaimer | Privacy Policy | Terms of Use
All Department of Defense speakers are subject to budget travel changes.

*Participation by any United States Federal Agency in any TechConnect activity or event does not constitute an expressed or implied endorsement of anycosponsor, donor, grantee, contractor or participant’s opinions, products, or services.