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Enter the Defense Business Accelerator (DBX) Microelectronics Challenge, and earn funding up to $2M to commercialize your technology!

The Challenge, in a major initiative to innovate how the Department of Defense spurs commercial technology development, will open doors for industrial base growth and stimulate private investment. It will accelerate solution development and improve longevity of suppliers.

Following an open solicitation for submissions, finalists will pitch at Defense TechConnect Innovation Summit in November to a panel of industry, government, and investment experts. Up to ten (10) winners will earn up to a combined $10M in funding.

DoD funding usually focuses on a DoD solution with hopes that the solution will be commercialized so that DoD can buy it again and again. Unfortunately, the model often does not work, necessitating DoD reinvestment. The Defense Business Accelerator will flip the script and focus first on commercialization, giving DoD the chance to leverage dual-use technologies.

The Challenge combines electronics industry expertise of the U.S. Partnership for Assured Electronics (USPAE) and the DoD's Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) with tactical support from Advanced Technology International (ATI) and, specifically, the TechConnect division.

2023 Submissions Closed

2023 Defense Business Accelerator (DBX) Microelectronics Challenge


  • Freedom Photonics, LLC
  • Gigantor Technologies
  • Momentum Optics
  • Mosaic Microsystems, LLC
  • Pseudolithic, Inc.
  • SiliconCore Technology, Inc.
  • Soctera, Inc.

The program seeks to identify commercially viable microelectronics solutions. Following are examples of topic interests:

  • Additive Manufacturing Electronics Technologies and Materials
  • Advanced Conventional Devices
  • Advanced Display Technologies
  • Advanced Electronics-Based Sensors
  • Advanced Materials and Characterization
  • Advanced Packaging Technologies
  • Electronics For Extreme Environments
  • High-Performance Electronics Materials
  • Novel Communication Technologies
  • PCB Manufacturing and IC Substrates
  • Power/High-Frequency Electronics
  • Rapid Analysis Technologies For Electronics Reliability or Security
  • Rapid Manufacturing Processes
  • Ultra-High Density Interconnects (UHDI)
  • Unconventional Computing Devices
  • Other Microelectronics Technologies